Semiconductor device including a field effect transistor

ABSTRACT

A semiconductor device includes a substrate having a plurality of active patterns. A plurality of gate electrodes intersects the plurality of active patterns. An active contact is electrically connected to the active patterns. A plurality of vias includes a first regular via and a first dummy via. A plurality of interconnection lines is disposed on the vias. The plurality of interconnection lines includes a first interconnection line disposed on both the first regular via and the first dummy via. The first interconnection line is electrically connected to the active contact through the first regular via. Each of the vias includes a via body portion and a via barrier portion covering a bottom surface and sidewalls of the via body portion. Each of the interconnection lines includes an interconnection line body portion and an interconnection line barrier portion covering a bottom surface and sidewalls of the interconnection line body portion.

CROSS-REFERENCE TO RELATED APPLICATION

This U.S. non-provisional patent application claims priority under 35U.S.C. § 119 to Korean Patent Application No. 10-2017-0068600, filed onJun. 1, 2017 and Korean Patent Application No. 10-2017-0109633, filed onAug. 29, 2017, in the Korean Intellectual Property Office, thedisclosures of which are hereby incorporated by reference in theirentirety.

TECHNICAL FIELD

The present disclosure relates to a semiconductor device and, moreparticularly, to a semiconductor device including a field effecttransistor.

DISCUSSION OF THE RELATED ART

Semiconductor devices may include semiconductor memory devices that areused for storing logical data, semiconductor logic devices that are usedfor processing logical data, and hybrid semiconductor devices havingboth the function of the semiconductor memory devices and the functionof the semiconductor logic devices. Semiconductor devices withhigh-reliable, high-speed, and/or multiple functionality have beenincreasingly demanded. However, such semiconductor devices may be highlyintegrated and particularly complex.

SUMMARY

A semiconductor device includes a substrate having a plurality of activepatterns. A plurality of gate electrodes intersects the plurality ofactive patterns. An active contact is electrically connected to theplurality of active patterns. A plurality of vias includes a firstregular via and a first dummy via. A plurality of interconnection linesis disposed on the plurality of vias. The plurality of interconnectionlines includes a first interconnection line disposed on both the firstregular via and the first dummy via. The first interconnection line iselectrically connected to the active contact through the first regularvia. Each of the plurality of vias includes a via body portion and a viabarrier portion covering a bottom surface and sidewalls of the via bodyportion. Each of the plurality of interconnection lines includes aninterconnection line body portion and an interconnection line barrierportion covering a bottom surface and sidewalls of the interconnectionline body portion.

A semiconductor device includes a substrate and a plurality oftransistors disposed on the substrate. A first interlayer insulatinglayer covers the plurality of transistors. A second interlayerinsulating layer is disposed on the first interlayer insulating layer. Athird interlayer insulating layer is disposed on the second interlayerinsulating layer. A dummy via is disposed in the second interlayerinsulating layer. An interconnection line is disposed on the thirdinterlayer insulating layer. The first interlayer insulating layercovers a bottom surface of the dummy via. The dummy via includes a viabody portion and a via barrier portion covering a bottom surface andsidewalls of the via body portion. The interconnection line includes aninterconnection line body portion and an interconnection line barrierportion covering a bottom surface and sidewalls of the interconnectionline body portion. The interconnection line barrier portion of theinterconnection line is disposed between the body portion of the dummyvia and the body portion of the interconnection line.

A semiconductor device includes a substrate and a first interlayerinsulating layer disposed on the substrate. A second interlayerinsulating layer is disposed on the first interlayer insulating layer. Athird interlayer insulating layer is disposed on the second interlayerinsulating layer. A connection structure is disposed in the firstinterlayer insulating layer. A plurality of vias is disposed in thesecond interlayer insulating layer. The plurality of vias includes aregular via and a dummy via. An interconnection line is disposed in thethird interlayer insulating layer. The regular via is disposed betweenthe interconnection line and the connection structure and electricallyconnects the interconnection line to the connection structure. The dummyvia is spaced apart from the connection structure. A top surface of thefirst interlayer insulating layer covers a bottom surface of the dummyvia.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present disclosure and many of theattendant aspects thereof will be readily obtained as the same becomesbetter understood by reference to the following detailed descriptionwhen considered in connection with the accompanying drawings, wherein:

FIG. 1 is a schematic block diagram illustrating a computer system forperforming a semiconductor design process, according to exemplaryembodiments of the inventive concepts;

FIG. 2 is a flowchart illustrating a method for designing andmanufacturing a semiconductor device, according to exemplary embodimentsof the inventive concepts;

FIG. 3 is a diagram illustrating a layout of a standard cell providedfrom a cell library;

FIG. 4 is a diagram illustrating a layout of a standard cell accordingto exemplary embodiments of the inventive concepts, which is providedfrom a cell library;

FIG. 5 is a plan view illustrating a semiconductor device according toexemplary embodiments of the inventive concepts;

FIGS. 6A to 6E are cross-sectional views taken along lines A-A′, B-B′,C-C′, D-D′, and E-E′ of FIG. 5, respectively;

FIG. 7 is a diagram illustrating a layout of a standard cell accordingto exemplary embodiments of the inventive concepts, which is providedfrom a cell library;

FIG. 8 is a diagram illustrating a layout of a standard cell accordingto exemplary embodiments of the inventive concepts, which is providedfrom a cell library;

FIG. 9 is a plan view illustrating a semiconductor device according toexemplary embodiments of the inventive concepts;

FIGS. 10A and 10B are cross-sectional views taken along lines A-A′ andB-B′ of FIG. 9, respectively;

FIG. 11 is a diagram illustrating a layout of a high-voltage transistorprovided from a cell library;

FIG. 12 is a diagram illustrating a layout of a high-voltage transistoraccording to exemplary embodiments of the inventive concepts, which isprovided from a cell library;

FIG. 13 is a plan view illustrating a semiconductor device according toexemplary embodiments of the inventive concepts;

FIGS. 14A to 14C are cross-sectional views taken along lines A-A′, B-B′,and C-C′ of FIG. 13, respectively;

FIG. 15 is a diagram illustrating a layout of a resistance structureprovided from a cell library;

FIG. 16 is a diagram illustrating a layout of a resistance structureaccording to exemplary embodiments of the inventive concepts, which isprovided from a cell library;

FIG. 17 is a plan view illustrating a semiconductor device according toexemplary embodiments of the inventive concepts;

FIG. 18 is a cross-sectional view taken along a line A-A′ of FIG. 17;

FIG. 19 is a diagram illustrating a layout of a capacitor provided froma cell library;

FIG. 20 is a layout of a capacitor according to exemplary embodiments ofthe inventive concepts, which is provided from a cell library;

FIG. 21 is a plan view illustrating a semiconductor device according toexemplary embodiments of the inventive concepts;

FIG. 22 is a cross-sectional view taken along a line A-A′ of FIG. 21;

FIG. 23 is a layout of a capacitor according to exemplary embodiments ofthe inventive concepts, which is provided from a cell library;

FIG. 24 is a plan view illustrating a semiconductor device according toexemplary embodiments of the inventive concepts; and

FIG. 25 is a cross-sectional view taken along a line A-A′ of FIG. 24.

DETAILED DESCRIPTION OF THE DRAWINGS

In describing exemplary embodiments of the present disclosureillustrated in the drawings, specific terminology is employed for sakeof clarity. However, the present disclosure is not intended to belimited to the specific terminology so selected, and it is to beunderstood that each specific element includes all technical equivalentswhich operate in a similar manner.

FIG. 1 is a schematic block diagram illustrating a computer system forperforming a semiconductor design process, according to exemplaryembodiments of the inventive concepts. Referring to FIG. 1, a computersystem may include a central processing unit (CPU) 10, a working memory30, an input/output (I/O) device 50, and an auxiliary storage device 70.In some exemplary embodiments of the present invention, the computersystem may be a customized system for performing a layout designprocess. In addition, the computer system may include and executevarious design and verification simulation programs.

The CPU 10 may be configured to execute a variety of software (e.g.,application programs, an operating system, and device drivers). The CPU10 may execute the operating system loaded in the working memory 30. Inaddition, the CPU 10 may execute various application programs driven onthe operating system. For example, the CPU 10 may execute a layoutdesign tool 32, a placement and routing tool 34 and/or an OPC toolloaded in the working memory 30.

The operating system or the application programs may be loaded in theworking memory 30. For example, when the computer system starts abooting operation, an image of the operating system stored in theauxiliary storage device 70 may be loaded in the working memory 30according to a booting sequence. Overall input/output operations of thecomputer system may be managed by the operating system. Likewise, theapplication programs, which may be selected by a user or may be providedfor basic services, may be loaded in the working memory 30.

The layout design tool 32 for the layout design process may be loadedfrom the auxiliary storage device 70 into the working memory 30. Theplacement and routing tool 34 may be loaded from the auxiliary storagedevice 70 into the working memory 30. The placement and routing tool 34may place designed standard cells, may realign inner interconnectionline patterns in the placed standard cells, and may route the placedstandard cells. The OPC tool 36 of performing optical proximitycorrection (OPC) on designed layout data may be loaded from theauxiliary storage device 70 into the working memory 30.

The layout design tool 32 may have a bias function for changing ormodifying shapes and positions, defined by a resign rule, of specificlayout patterns. In addition, the layout design tool 32 may perform adesign rule check (DRC) under a bias data condition modified by the biasfunction. The working memory 30 may include a volatile memory device(e.g., a static random access memory (SRAM) device or a dynamic randomaccess memory (DRAM) device) and/or a non-volatile memory device (e.g.,a PRAM device, a MRAM device, a ReRAM device, a FRAM device, or a NORflash memory device).

The I/O device 50 may control input and output operations of a userthrough user interface devices. For example, the I/O device 50 mayinclude a keyboard and/or a monitor and may receive relevant informationfrom a designer. By using the I/O device 50, the designer may receiveinformation on semiconductor regions or data paths which requireadjusted operating characteristics. In addition, a process and processedresults of the OPC tool 36 may be displayed through the I/O device 50.

The auxiliary storage device 70 may serve as a storage medium of thecomputer system. The auxiliary storage device 70 may store theapplication programs, the image of the operating system, and variousother data. The auxiliary storage device 70 may be provided in the formof a memory card (e.g., MMC, eMMC, SD, or Micro SD) and/or a hard diskdrive (HDD). In some exemplary embodiments of the present invention, theauxiliary storage device 70 may include a NAND-type flash memory devicehaving a large storage capacity. Alternatively, the auxiliary storagedevice 70 may include a next-generation non-volatile memory devices(e.g., PRAM, MRAM, ReRAM, or FRAM) and/or NOR flash memory devices.

A system interconnector 90 may serve as a system bus for providing adata network within the computer system. The CPU 10, the working memory30, the I/O device 50, and the auxiliary storage device 70 may each beelectrically connected to each other through the system interconnector90, and data may be exchanged therebetween through the systeminterconnector 90. However, the system interconnector 90 is not limitedto the aforementioned configuration. In certain exemplary embodiments ofthe preset invention, the system interconnector 90 may further includean additional element for increasing efficiency in data communication.

FIG. 2 is a flowchart illustrating a method for designing andmanufacturing a semiconductor device, according to exemplary embodimentsof the inventive concepts.

Referring to FIG. 2, a high-level design process of a semiconductorintegrated circuit may be performed using the computer system describedwith reference to FIG. 1 (S10). The high-level design process mayinclude designing an integrated circuit with a high-level computerlanguage. For example, the high-level computer language may be a Clanguage. Circuits designed by the high-level design process may be moreconcretely described by a register transfer level (RTL) coding orsimulation. In addition, codes generated by the RTL coding may beconverted into netlists, and the netlists may be combined with eachother to realize an entire semiconductor device. The combined schematiccircuit may be verified by a simulation tool. In some exemplaryembodiments of the present invention, an adjusting operation may furtherbe performed based on results of the verification.

A layout design process may be performed to realize a logicallycompleted semiconductor integrated circuit on a silicon substrate (S20).For example, the layout design process may be performed based on theschematic circuit prepared in the high-level design process or thenetlist corresponding thereto. The layout design process may include arouting operation of placing and connecting various standard cells thatare provided from a cell library based on a predetermined design rule.

The cell library for the layout design process may also includeinformation on operations, speeds and power consumption of the standardcells. In some exemplary embodiments of the present invention, a celllibrary for representing a layout of a circuit having a specific gatelevel may be defined in most layout design tools. Here, the layout may,define or describe shapes and sizes of patterns for constitutingtransistors and metal interconnection lines which will be physicallyformed on a silicon substrate. For example, layout patterns (e.g., PMOS,NMOS, N-WELL, gate electrodes, and metal interconnection lines to bedisposed thereon) may be placed to physically form an inverter circuiton a silicon substrate. For this, inverters defined in the cell librarymay be searched and selected.

The routing operation may be performed on the selected and placedstandard cells. For example, upper interconnection lines (e.g., routingpatterns) may be placed on the placed standard cells. The placedstandard cells may be connected to each other by the routing operationto fit the design. The placement and routing of the standard cells maybe automatically performed by the placement and routing tool 34.

After the routing operation, a verification operation may be performedon the layout to verify whether there is a portion violating the designrule. In some exemplary embodiments of the present invention, theverification operation may include evaluating verification items, suchas a design rule check (DRC) item, an electrical rule check (ERC) item,and a layout vs schematic (LVS) item. The DRC item may be performed tocheck whether the layout meets the design rule. The ERC item may beperformed to check whether there is an issue of electrical disconnectionin the layout. The LVS item may be performed to check whether the layoutis prepared to coincide with the gate-level netlist.

An optical proximity correction (OPC) process may be performed (S30).The layout patterns obtained by the layout design process may berealized on a silicon substrate by a photolithography process. The OPCprocess may be performed to correct an optical proximity effect whichmay occur in the photolithography process. The optical proximity effectmay be an unintended optical effect (such as refraction or diffraction)which may occur in the photolithography process. For example, adistortion phenomenon of layout patterns, which may be caused by theoptical proximity effect, may be corrected by the OPC process. Theshapes and positions of the designed layout patterns may be modified orbiased by the OPC process.

A photomask may be generated based on the layout modified by the OPCprocess (S40). In general, the photomask may be generated by patterninga chromium layer deposited on a glass substrate by using the layoutpattern data.

A semiconductor device may be manufactured using the generated photomask(S50). Various exposure and etching processes may be repeated in themanufacture of the semiconductor device using the photomask. By theseprocesses, shapes of patterns obtained in the layout design process maybe sequentially formed on a silicon substrate.

FIG. 3 is a figure illustrating a layout of a standard cell providedfrom a cell library.

Referring to FIGS. 2 and 3, the cell library of the layout designprocess (S20) may include standard cells. For example, in FIG. 3, astandard cell STD provided from the cell library may be a NAND cell. Thestandard cell STD may include a first active region AR1 a, a secondactive region AR2 a, gate patterns GEa, active contact patterns ACa,gate contact patterns GCa, connection patterns CPa, via patterns VIra,and interconnection line patterns M1 ra.

The first active region AR1 a and the second active region AR2 a mayextend in a second direction D2. The first active region AR1 a and thesecond active region AR2 a may be spaced apart from each other in afirst direction D1. The first direction D1 may intersect (e.g., beperpendicular to) the second direction D2. The first active region AR1 aand the second active region AR2 a may define a PMOSFET region and anNMOSFET region, respectively.

The gate patterns GEa may extend in the first direction D1 and may bearranged in the second direction D2. The gate patterns GEa may intersectthe first active region AR1 a and the second active region AR2 a. Thegate patterns GEa may define gate electrodes.

The active contact patterns ACa may be disposed on the first and secondactive 110 regions AR1 a and AR2 a. The active contact patterns ACa maybe disposed between the gate patterns GEa. The gate contact patterns GCamay be disposed between the first and second active regions AR1 a andAR2 a. The gate contact patterns GCa may be disposed on the gatepatterns GEa. The active contact patterns ACa may define activecontacts, and the gate contact patterns GCa may define gate contacts.

The connection patterns CPa may overlap the active contact patterns ACaand the gate patterns GEa. At least one of the connection patterns CPamay further extend from one end of the active contact pattern ACa in thefirst direction D1. At least one of the connection patterns CPa may atleast partially overlap with the interconnection line pattern M1 radefining a power interconnection line to which a power voltage isapplied. At least one of the connection patterns CPa may at leastpartially overlap with the interconnection line pattern M1 ra defining aground interconnection line to which a ground voltage is applied. Theconnection patterns CPa may define connection structures.

The via patterns VIra may be placed or disposed on the connectionpatterns CPa. The interconnection line patterns M1 ra may be placed ordisposed on the via patterns VIra. The interconnection line patterns M1ra extending in the second direction D2 on both boundaries of thestandard cell. STD may define the power interconnection line and theground interconnection line. The via patterns VIra may define vias, andthe interconnection line patterns M1 ra may define interconnectionlines.

FIG. 4 is a diagram illustrating a layout of a standard cell accordingto exemplary embodiments of the inventive concepts, which is providedfrom a cell library. To the extent that descriptions of various featuresof various elements are omitted, these features may be understood to beat least similar to corresponding features of corresponding elementsdescribed elsewhere in this specification. Accordingly, differencesbetween the present embodiment and the standard cell of FIG. 3 will bemainly described hereinafter.

Referring to FIGS. 2 and 4, the layout design process (S20) may includeplacing additional layout patterns on the standard cell STD of FIG. 3.In more detail, dummy via patterns VIda and a dummy interconnection linepattern M1 da may further be placed on the standard cell STD of FIG. 3.

The standard cell STD, according to exemplary embodiments of the presentinvention, may include via patterns VIa and interconnection linepatterns M1 a. The via patterns VIa may include regular via patternslira and the dummy via patterns VIda. The interconnection line patternsM1 a may include regular interconnection line patterns M1 ra and thedummy interconnection line pattern M1 da.

The dummy via patterns VIda may be provided in an area in which theconnection patterns CPa are absent from. The dummy via patterns VIda maybe provided in an area in which the active contact patterns ACa and thegate contact patterns GCa are absent from. The dummy via patterns VIdamay overlap with the interconnection line patterns M1 a.

In some exemplary embodiments of the present invention, the dummy viapatterns VIda may overlap with the regular interconnection line patternsM1 ra defining the power interconnection line and the groundinterconnection line. In some exemplary embodiments of the presentinvention, at least one of the dummy via patterns VIda may overlap withthe dummy interconnection line pattern M1 da provided between the firstand second active regions AR1 a and AR2 a. According to exemplaryembodiments of the present invention, at least one of the dummy viapatterns VIda may overlap with at least one of the regularinterconnection line patterns M1 ra.

The dummy via patterns VIda added in this manner may increase the numberof the via patterns VIa in the standard cell STD. For example, thestandard cell STD may have a relatively high pattern density of the viapatterns VIa. In the present specification, the term ‘pattern density’may refer to the number of patterns per unit area. Since the patterndensity of the via patterns VIa is increased, it is possible to reduceor minimize a distortion phenomenon of light which may occur in anexposure process for realizing the via patterns VIa.

FIG. 5 is a plan view illustrating a semiconductor device according toexemplary embodiments of the inventive concepts. FIGS. 6A to 6E arecross-sectional views taken along lines A-A′, B-B′, C-C′, D-D′, and E-E′of FIG. 5, respectively. A semiconductor device illustrated in FIGS. 5and 6A to 6E is an example of a semiconductor device that is realized ona physical substrate by using the layout of the standard cell of FIG. 4.

Referring to FIGS. 5 and 6A to 6E, a logic cell LC may be provided on asubstrate 100. Logic transistors for constituting a logic circuit may bedisposed in the logic cell LC. For example, the logic cell LC, of FIG. 5may be a NAND cell. Hereinafter, the logic transistors andinterconnection lines of the logic cell LC will be described in moredetail.

The substrate 100 may be a silicon substrate, a germanium substrates ora silicon-on-insulator (SOI) substrate. Second device isolation layersST2 may be provided in the substrate 100 to define a PMOSFET region PRand an NMOSFET region NR. The second device isolation layers ST2 may beformed in an upper portion of the substrate 100.

The PMOSFET region PR and the NMOSFET region NR may be spaced apart fromeach other in a first direction D1 with the second device isolationlayer ST2 interposed therebetween. The PMOSFET region PR and the NMOSFETregion NR may extend in a second direction D2 to intersect the logiccell LC. The second device isolation layers ST2 may define additionalPMOSFET regions and additional NMOSFET regions as well as the PMOSFETregion PR and the NMOSFET region NR.

A plurality of first active patterns FN1 extending in the seconddirection D2 may be provided on the PMOSFET region PR. A plurality ofsecond active patterns FN2 extending in the second direction D2 may beprovided on the NMOSFET region NR. The first and second active patternsFN1 and FN2 may be portions of the substrate 100, which protrude from atop surface of the substrate 100. The first and second active patternsFN1 and FN2 may be arranged along the first direction D1.

For example, three first active patterns FN1 may extend in the seconddirection D2 in parallel with each other on the PMOSFET region PR. Forexample, three second active patterns FN2 may extend in the seconddirection D2 in parallel with each other on the NMOSFET region NR.However, the number and shapes of the first active patterns FN1 on thePMOSFET region PR and the number and shapes of the second activepatterns FN2 on the NMOSFET region NR may be varied from what isillustrated in FIGS. 5 and 6A to 6E and the present invention mayutilize any number and shapes for the first and second active patterns.

First device isolation layers ST1 extending in the second direction D2may be disposed at both sides of each of the first and second activepatterns FN1 and FN2. Some of the first device isolation layers ST1 mayfill trenches between the first active patterns FN1. Others of the firstdevice isolation layers ST1 may fill trenches between the second activepatterns FN2.

Upper portions of the first and second active patterns FN1 and FN2 maybe higher than top surfaces of the first device isolation layers ST1.The upper portions of the first and second active patterns FN1 and FN2may protrude vertically from the first device isolation layers ST1. Theupper portion of each of the first and second active patterns FN1 andFN2 may have a fin-shape protruding from between a pair of the firstdevice isolation layers ST1.

The second device isolation layers ST2 and the first device isolationlayers ST1 may be connected to each other to constitute one insulatinglayer. Top surfaces of the second device isolation layers ST2 may becoplanar with the top surfaces of the first device isolation layers ST1.Thicknesses (or depths) of the second device isolation layers ST2 may begreater than thicknesses (or depths) of the first device isolationlayers ST1. In this case, the first device isolation layers ST1 may beformed by a process different from a process of forming the seconddevice isolation layers ST2. For example, the first and second deviceisolation layers ST1 and ST2 may each include a silicon oxide layer.

First channel regions CH1 and first source/drain regions SD1 may beprovided in the upper portions of the first active patterns FN1. Thefirst source/drain regions SD1 may be P-type dopant regions. Each of thefirst channel regions CH1 may be disposed between a pair of the firstsource/drain regions SD1 adjacent to each other. Second channel regionsCH2 and second source/drain regions SD2 may be provided in the upperportions of the second active patterns FN2. The second source/drainregions SD2 may be N-type dopant regions. Each of the second channelregions CH2 may be disposed between a pair of the second source/drainregions SD2 adjacent to each other.

The first and second source/drain regions SD1 and SD2 may each includeepitaxial patterns formed by a selective epitaxial growth (SEG) process.Top surfaces of the first and second source/drain regions SD1 and SD2may each be disposed at a higher level than top surfaces of the firstand second channel regions CH1 and CH2. Each of the first and secondsource/drain regions SD1 and SD2 may include a semiconductor elementdifferent from that of the substrate 100. According to exemplaryembodiments of the present invention, the first source/drain regions SD1may include a semiconductor element of which a lattice constant isgreater than that of the semiconductor element of the substrate 100.Thus, the first source/drain regions SD1 may provide compressive stressto the first channel regions CH1. According to exemplary embodiments ofthe present invention, the second source/drain regions SD2 may include asemiconductor element of which a lattice constant is smaller than thatof the semiconductor element of the substrate 100. Thus, the secondsource/drain regions SD2 may provide tensile stress to the secondchannel regions CH2. In some exemplary embodiments of the presentinvention, the second source/drain regions SD2 may include the samesemiconductor element as the substrate 100.

Cross-sectional shapes of the first source/drain regions SD1 may bedifferent from cross-sectional shapes of the second source/drain regionsSD2 when viewed in a cross-sectional view taken along the firstdirection D1 (see FIG. 6D). For example, the first source/drain regionsSD1 may include silicon-germanium (Site), and the second source/drainregions SD2 may include silicon.

Gate electrodes GE extending in the first direction D1 may intersecteach of the first and second active patterns FN1 and FN2. The gateelectrodes GE may be spaced apart from each other in the seconddirection D2. The gate electrodes GE may vertically overlap with each ofthe first and second channel regions CH1 and CH2. Each of the gateelectrodes GE may surround a top surface and both sidewalls of each ofthe first and second channel regions CH1 and CH2 (see FIGS. 6B and 6C).For example, the gate electrodes GE may include a conductive metalnitride (e.g., titanium nitride or tantalum nitride) and/or a metalmaterial (e.g., titanium, tantalum, tungsten, copper, or aluminum).

A pair of gate spacers GS may be disposed on both (opposite) sidewallsof each of the gate electrodes GE, respectively. The gate spacers GS mayextend along the gate electrodes GE in the first direction D1. Topsurfaces of the gate spacers GS may be higher than top surfaces of thegate electrodes GE. The top surfaces of the gate spacers GS may becoplanar with a top surface of a gate capping layer GP, as is describedin detail below. For example, the gate spacers GS may include SiCN,SiCON, and/or SiN. In some exemplary embodiments of the presentinvention, each of the gate spacers GS may have a multi-layeredstructure formed of at least two of SiCN, SiCON, or SiN.

Gate dielectric layers GI may be disposed between the gate electrodes GEand the active patterns FN1 and FN2. Each of the gate dielectric layersGI may extend along a bottom surface of each of the gate electrodes GE.Each of the gate dielectric layers GI may cover the top surface and theboth sidewalls of each of the first and second channel regions CH1 andCH2. The gate dielectric layers GI may include a high-k dielectricmaterial of which a dielectric constant is higher than that of siliconoxide. For example, the high-k dielectric material may include hafniumoxide, hafnium-silicon oxide, lanthanum oxide, zirconium oxide,zirconium-silicon oxide, tantalum oxide, titanium oxide,barium-strontium-titanium oxide, barium-titanium oxide,strontium-titanium oxide, lithium oxide, aluminum oxide,lead-scandium-tantalum oxide, and/or lead-zinc niobate.

A gate capping layer UP may be provided on each of the gate electrodesGE. The gate capping layers GP may extend along the gate electrodes GEin the first direction D1. The gate capping layers GP may include amaterial having an etch selectivity with respect to a first interlayerinsulating layer 110, as is described in additional detail below. Forexample, the gate capping layers GP may include SiON, SiCN, SiCON,and/or SiN.

A first interlayer insulating layer 110 may cover each of the first andsecond active patterns FN1 and FN2, the gate spacers GS, and the gatecapping layers GP. Second to fifth interlayer insulating layers 120,130, 140 and 150 may be sequentially stacked on the first interlayerinsulating layer 110. Each of the first to fifth interlayer insulatinglayers 110 to 150 may include a silicon oxide layer or a siliconoxynitride layer.

At least one active contact AC may penetrate the first interlayerinsulating layer 110 between a pair of the gate electrodes GE so as tobe electrically connected to the first and/or second source/drainregions SD1 and/or SD2. The active contacts AC may have bar shapesextending in the first direction D1 According to exemplary embodimentsof the present invention, at least one active contact AC may beconnected to a plurality of the first source/drain regions SD1.According to exemplary embodiments of the present invention, at leastone active contact AC may be connected to a plurality of the secondsource/drain regions SD2. In some exemplary embodiments of the presentinvention, at least one active contact AC may be connected to one firstsource/drain region SD1 or one second source/drain region SD2. However,the present inventive concepts may have various alternativeconfigurations.

At least one gate contact GC may penetrate the first interlayerinsulating layer 110 and the gate capping layer GP so as to beelectrically connected to at least one gate electrode GE. The gatecontacts GC may be disposed between the PMOSFET region PR and theNMOSFET region NR when viewed in a plan view. The gate contacts GC mayvertically overlap with the second device isolation layer ST2 betweenthe PMOSFET region PR and the NMOSFET region NR.

The active contact AC and the gate contact GC may each include a bodyportion P1 and a barrier portion P2. The barrier portion P2 may cover abottom surface and sidewalls of the body portion P1. The barrier portionP2 might not cover a top surface of the body, portion P1.

The body portions P1 of the active contacts AC may include the sameconductive material as the body portions P1 of the gate contacts GC. Forexample, the body portions P1 of the active contacts AC and the gatecontacts GC may include aluminum, copper, tungsten, molybdenum, and/orcobalt. The barrier portion P2 of each of the active contacts AC and thegate contacts GC may include a metal layer/a metal nitride layer. Themetal layer may include titanium, tantalum, tungsten, nickel, cobalt,and/or platinum. The metal nitride layer may include a titanium nitride(TiN) layer, a tantalum nitride (TaN) layer, a tungsten nitride (WN)layer, a nickel nitride (NiN) layer, a cobalt nitride (CoN) layer,and/or a platinum nitride (PtN) layer.

Connection structures CP may be provided on the active contacts AC, andthe gate contacts GC. The connection structures CP may penetrate thesecond and third interlayer insulating layers 120 and 130 so as to beelectrically connected to the active contacts AC and the gate contactsGC. The connection structures CP may overlap with the active contacts ACand the gate contacts GC when viewed in a plan view. At least oneconnection structure CP on the active contact AC may further extend fromone end of the active contact AC in the first direction D1. Thus, theextending portion of the at least one connection structure CP may bedisposed under a power interconnection line VDD or a groundinterconnection line VSS of regular interconnection lines M1 r.

Each of the connection structures CP may include a body portion P1 and abarrier portion P2. Descriptions to the body portion P1 and the barrierportion P2 of the connection structure CP may be substantially the sameas the descriptions to the body portion P1 and the barrier portion P2 ofeach of the active and gate contacts AC and GC described above. The bodyportion P1 of each of the connection structures CP may include the sameconductive material as the body portion P1 of each of the activecontacts AC and the gate contacts GC. The barrier portion P2 of each ofthe connection structures CP may include the same barrier material asthe barrier portion P2 of each of the active contacts AC and the gatecontacts GC.

Vias VI may be provided in the fourth interlayer insulating layer 140.The vias VI may include regular vias VIr which are electricallyconnected to the connection structures CP, and dummy vias VId which arenot electrically connected to the connection structures CP. For example,the regular vias VIr may be electrically connected to the activecontacts AC and/or the gate contacts GC. The dummy vias VId might not beelectrically connected to the active contacts AC and the gate contactsGC. The dummy vias VId may be spaced apart from the connectionstructures CP, the active contacts AC, and the gate contacts GC. Thethird interlayer insulating layer 130 may completely cover bottomsurfaces of the dummy vias VId.

At least one of the dummy vias VId may overlap with the gate electrodeGE when viewed in a plan view. The at least one dummy via VId may bespaced apart from the gate electrode GE with the first to thirdinterlayer insulating layers 110, 120 and 130 interposed therebetween.Thus, the at least one dummy via VId might not be electrically connectedto the gate electrode GE.

Each of the vias VI may include a body portion P1 and a barrier portionP2. Descriptions to the body portion P1 and the barrier portion P2 ofeach of the vias VI may be substantially the same as the descriptions tothe body portion P1 and the barrier portion P2 of each of the active andgate contacts AC and GC described above. The body portion P1 of each ofthe vias VI may include a conductive material different from that of thebody portion P1 of each of the active contacts AC and the gate contactsGC. The barrier portion P2 of each of the vias VI may include a barriermaterial which is the same as or different from that of the barrierportion P2 of each of the active contacts AC and the gate contacts GC.

Interconnection hues M1 may be provided in the fifth interlayerinsulating layer 150. The interconnection lines M1 may constitute afirst metal layer. The interconnection lines M1 may include regularinterconnection lines M1 r and at least one dummy interconnection lineM1 d. The regular interconnection lines M1 r may be electricallyconnected to the active contacts AC and/or the gate contacts GC throughthe regular vias VIr and the connection structures CP. The dummyinterconnection line M1 d may be connected to only the dummy via VId andthus might not be electrically connected to the active contacts AC andthe gate contacts GC.

Each of the interconnection lines M1 may include a body portion P1 and abarrier portion P2. Descriptions to the body portion P1 and the barrierportion P2 of each of the interconnection lines M1 may be substantiallythe same as the descriptions to the body portion P1 and the barrierportion P2 of each of the active and gate contacts AC and GC describedabove. The body portion P1 of each of the interconnection lines M1 mayinclude the same conductive material as the body portion P1 of each ofthe vias VI. The barrier portion P2 of each of the interconnection linesM1 may include the same barrier material as the barrier portion P2 ofeach of the vias VI. For example, the body portions P1 of theinterconnection lines M1 and the vias VI may include copper. The bodyportions P1 of the active contacts AC, the gate contacts GC and theconnection structures CP may include cobalt.

Some of the vias VI may be disposed between the connection structures CPand corresponding ones of the interconnection lines M1 to electricallyconnect the corresponding interconnection lines M1 to the connectionstructures CP. The vias VI may be formed by a single damascene process,and the interconnection lines M1 may be formed by a single damasceneprocess after the formation of the vias VI. Thus, the barrier portion P2of the interconnection line M1 may be disposed between the body portionP1 of the interconnection line M1 and the body portion P1 of the via VI.

The interconnection lines M1 may include a power interconnection lineVDD and a ground interconnection line VSS which extend in the seconddirection D2 on both boundaries of the logic cell LC. The dummy vias VIdas well as the regular vias VIr may be connected to each of the powerinterconnection line VDD and the ground interconnection line VSS. Theregular vias VIr and the dummy vias VId connected to each of the powerand ground interconnection lines VDD and VSS may be arranged in thesecond direction D2.

FIG. 7 is a layout of a standard cell according to exemplary embodimentsof the present inventive concepts, which is provided from a celllibrary. Here, the descriptions to the same technical features asdescribed above with respect to FIGS. 3 and 4 may be omitted and it maybe assumed that the omitted descriptions are at least similar to thedescriptions of corresponding elements discussed elsewhere within thepresent disclosure. For example, differences between the arrangement ofFIG. 7 and the arrangements of FIGS. 3 and 4 will be mainly describedhereinafter.

Referring to FIGS. 2 and 7, the layout design process (S20) may includemarking the standard cell STD of FIG. 3 with positions at which dummyvia patterns can be placed. For example, marks MA may be placed on thelayout of the standard cell STD. The marks MA may represent areas inwhich the dummy via patterns can be placed. The marks MA may be providedin an area in which the connection patterns CPa are absent from. Themarks MA may be provided in an area in which the active contact patternsACa and the gate contact patterns GCa are absent from.

Referring again to FIG. 4, the standard cell STD of FIG. 7 may be placedin a cell block in the routing operation of placing and routing thestandard cells. The dummy via patterns VIda may be placed on the marksMA of the standard cell STD.

FIG. 8 is a layout of a standard cell according to exemplary embodimentsof the present inventive concepts, which is provided from a celllibrary. Here, the descriptions to the same technical features as in theembodiments of FIGS. 3 and 4 will be omitted and it may be assumed thatthe omitted details are at least similar to details of correspondingelements described elsewhere. Differences between the present embodimentand the embodiments of FIGS. 3 and 4 will be mainly describedhereinafter.

Referring to FIGS. 2 and 8, the layout design process (S20) may includemodifying shapes of the interconnection line patterns M1 ra of thestandard cell STD of FIG. 3. For example, an extension pattern EPa maybe added to the interconnection line pattern M1 ra defining the powerinterconnection line to modify the shape of the interconnection linepattern M1 ra. An extension pattern EPa may be added to theinterconnection line pattern M1 ra defining the ground interconnectionline to modify the shape of the interconnection line pattern M1 ra.

The layout design process (S20) may include placing additional layoutpatterns on the standard cell STD of FIG. 3. For example, dummy viapatterns VIda and a dummy interconnection line pattern M1 da may furtherbe placed on the standard cell STD of FIG. 3. At least one dummy viapattern VIda may overlap with the extension pattern EPa of theinterconnection line pattern M1 ra defining the power interconnectionline.

The dummy via patterns VIda may include first dummy via patterns VIda1and a second dummy via pattern VIda2. The first dummy via patterns VIda1may be the same as the dummy via patterns VIda described with referenceto FIG. 4. The second dummy via pattern VIda2 may have a width in thefirst direction D1, which is greater than widths of the first dummy viapatterns VIda1 in the first direction D1.

FIG. 9 is a plan view illustrating a semiconductor device according toexemplary embodiments of the present inventive concepts. FIGS. 10A and10B are cross-sectional views taken along lines A-A′ and B-B′ of FIG. 9,respectively. A semiconductor device illustrated in FIGS. 9, 10A and 10Bis an example of a semiconductor device that is realized on a physicalsubstrate by using the layout of the standard cell of FIG. 8. Here, thedescriptions to the same technical features as in the embodiments ofFIGS. 5 and 6A to 6E will be omitted and it may be understood that theomitted details may at least be similar to details of correspondingelements descried elsewhere. Differences between the present embodimentand the embodiments of FIGS. 5 and 6A to 6E will be mainly describedhereinafter.

Referring to FIGS. 9, 10A, and 10B, dummy vias VId may include firstdummy vias VId1 and a second dummy via VId2. The first dummy vias VId1may be substantially the same as the dummy vias VId described withreference to FIGS. 5 and 6A to 6E. The second dummy via VId2 may have awidth in the first direction D1, which is greater than widths of thefirst dummy vias VId1 in the first direction D1. The second dummy viaVId2 may be provided under at least one regular interconnection line M1r. The second dummy via VId2 may be disposed between the PMOSFET regionPR and the NMOSFET region NR when viewed in a plan view.

The power interconnection line VDD may include an extension EP. Theextension EP of the power interconnection line VDD may extend from thepower interconnection line VDD toward the dummy interconnection line M1d. The first dummy via VId1 may be provided under the extension EP ofthe power interconnection line VDD.

The ground interconnection line VSS may include an extension EP. Theextension EP of the ground interconnection line VSS may extend from theground interconnection VSS in the first direction D1. The extension EPof the ground interconnection line VSS may vertically overlap a portionof the connection structure CP. The regular via VIr may be providedbetween the extension EP of the ground interconnection line. VSS and theconnection structure CP.

FIG. 11 is a diagram illustrating a layout of a high-voltage transistorprovided from a cell library.

Referring to FIGS. 2 and 11, the cell library of the layout designprocess (S20) may include a layout HTL of a high-voltage transistor. Thelayout HTL of the high-voltage transistor may include an active regionARa, a gate pattern GEa, active contact patterns ACa, connectionpatterns CPra, via patterns VIra, and interconnection line patterns M1a.

The active region ARa may define a transistor region. The gate patternGEa may extend in a first direction D1 to intersect the active regionARa. The gate pattern GEa may define a gate electrode. The activecontact patterns ACa may be placed on the active region ARa. The activecontact patterns ACa may be disposed at both sides of the gate patternGEa, respectively. The active contact patterns ACa may define activecontacts.

The connection patterns CPra may overlap with the active contactpatterns ACa. The connection patterns CPra may define connectionstructures. The via patterns VIra may be placed on the connectionpatterns CPra. The interconnection line patterns M1 a may be placed onthe via patterns VIra. The via patterns VIra may define vias, and theinterconnection line patterns M1 a may define interconnection lines.

FIG. 12 is a diagram illustrating a layout of a high-voltage transistoraccording to exemplary embodiments of the present inventive concepts,which is provided from a cell library. Here, the descriptions to thesame technical features as in the layout of the high-voltage transistorof FIG. 11 will be omitted and it may be understood that the omitteddetails are at least similar to the details of corresponding elementsdescribed elsewhere. For example, differences between the layout of FIG.12 and the layout of the high-voltage transistor of FIG. 11 will bemainly described hereinafter.

Referring to FIGS. 2 and 12, the layout design process (S20) may includeplacing additional layout patterns on the layout HTL of the high-voltagetransistor of FIG. 11. For example, dummy connection patterns CPda anddummy via patterns VIda may be additionally placed on the layout HTL ofthe high-voltage transistor of FIG. 11.

A layout of a high-voltage transistor may include connection patternsCPa. and via patterns VIa. The connection patterns CPa may includeregular connection patterns CPra and the dummy connection patterns CPda.The via patterns VIa may include regular via patterns VIra and the dummyvia patterns VIda.

The dummy connection patterns CPda may be provided in an area in whichthe active contact patterns ACa are absent from. The dummy connectionpatterns CPda may be provided on the gate pattern GEa. The dummy viapatterns VIda may overlap with the dummy connection patterns CPda.

The dummy connection patterns CPda added may increase a pattern densityof the connection patterns CPa in the layout HTL of the high-voltagetransistor. The dummy via patterns VIda added may increase a patterndensity of the via patterns VIa in the layout HTL of the high-voltagetransistor.

FIG. 13 is a plan view illustrating a semiconductor device according toexemplary embodiments of the present inventive concepts. FIGS. 14A to14C are cross-sectional views taken along lines A-A′, B-B′, and C-C′ ofFIG. 13, respectively. A semiconductor device illustrated in FIGS. 13and 14A to 14C is an example of a semiconductor device that is realizedon a physical substrate by using the layout of the high-voltagetransistor of FIG. 12.

Referring to FIGS. 13 and 14A to 14C, a high-voltage transistor EG maybe provided on a substrate 100. For example, a second device isolationlayer ST2 may be provided in the substrate 100 to define a transistorregion AR. A plurality of active patterns FN extending in a seconddirection D2 may be provided on the transistor region AR. First deviceisolation layers ST1 may be disposed at both sides of each of the activepatterns FN. A channel region CH and source/drain regions SD may beprovided in an upper portion of each of the active patterns FN. A gateelectrode GE may be provided on the active patterns FN. The gateelectrode GE may extend in a first direction D1 to intersect the activepatterns FN. First to fifth interlayer insulating layers 110, 120, 130,140 and 150 may be provided on the substrate 100 to cover the gateelectrode GE.

Active contacts AC may penetrate the first interlayer insulating layer110 so as to be electrically connected to the source/drain regions SD.The active contacts AC may have bar shapes extending in the firstdirection D1. Connection structures CP may be provided in the second andthird interlayer insulating layers 120 and 130. The connectionstructures CP may include regular connection structures CPr which areelectrically connected to the active contacts AC, and dummy connectionstructures CPd which are not electrically connected to the activecontacts AC.

The dummy connection structures CPd may overlap with the gate electrodeGE when viewed in a plan view. However, since the dummy connectionstructures CPd are disposed on the first interlayer insulating layer110, the dummy connection structures CPd may be vertically spaced apartfrom the gate electrode GE. Thus, the dummy connection structures CPdmight not be electrically connected to the gate electrode GE.

Vias VI may be provided in the fourth interlayer insulating layer 140.The vias VI may include regular vias VIr electrically connected to theregular connection structures CPr and dummy vias VId connected to thedummy connection structures CPd. Interconnection lines M1 may beprovided in the fifth interlayer insulating layer 150. Theinterconnection lines M1 may be electrically connected to the regularvias VIr.

FIG. 15 is a layout of a resistance structure provided from a celllibrary.

Referring to FIGS. 2 and 15, the cell library of the layout designprocess (S20) may include a layout RL of a resistance structure. Thelayout RL of the resistance structure may include a resistance patternRSa, connection patterns CPa, via patterns VIra, and interconnectionline patterns M1 a.

The resistance pattern RSa may define a resistance layer. The connectionpatterns CPa may be placed on the resistance pattern RSa. The connectionpatterns CPa may define connection structures. The via patterns VIra maybe placed on the connection patterns CPa. The interconnection linepatterns M1 a may be placed on the via patterns VIra. The via patternsVIra may define vias, and the interconnection line patterns M1 a maydefine interconnection lines.

FIG. 16 is a layout of a resistance structure according to exemplaryembodiments of the inventive concepts, which is provided from a celllibrary. In the present embodiment, the descriptions to the sametechnical features as in the layout of the resistance structure of FIG.15 will be omitted and it may be understood that the omitted details areat least similar to the details of corresponding elements describedelsewhere. Differences between the present embodiment and the layout ofthe resistance structure of FIG. 15 will be mainly described hereinafter.

Referring to FIGS. 2 and 16, the layout design process (S20) may includeplacing additional layout patterns on the layout RL of the resistancestructure of FIG. 15. For example, dummy via patterns VIda may beadditionally placed on the layout RL of the resistance structure of FIG.15.

A layout RL of a resistance structure may include via patterns VIa. Thevia patterns VIa may include regular via patterns VIra. and the dummyvia patterns VIda. The dummy via patterns VIda may be provided in anarea in which the connection patterns CPa are absent from. The dummy viapatterns VIda may overlap with the resistance pattern RSa.

The dummy via patterns VIda added may increase a pattern density of thevia patterns VIa in the layout RL of the resistance structure.

FIG. 17 is a plan view illustrating a semiconductor device according toexemplary embodiments of the present inventive concepts. FIG. 18 is across-sectional view taken along a line A-A′ of FIG. 17. A semiconductordevice illustrated in FIGS. 17 and 18 is an example of a semiconductordevice that is realized on a physical substrate by using the layout ofthe resistance structure of FIG. 16.

Referring to FIGS. 17 and 18, a resistance structure RES may be providedon a substrate 100. For example, a second device isolation layer ST2 maybe provided on the substrate 100. First to fifth interlayer insulatinglayers 110, 120, 130, 140 and 150 may be sequentially stacked on thesecond device isolation layer ST2.

A resistance layer RS may be provided in the second interlayerinsulating layer 120. The resistance layer RS may cover a top surface ofthe first interlayer insulating layer 110. A thickness of the resistancelayer RS may be smaller than a thickness of a connection structure CP, athickness of a via VI, and a thickness of an interconnection line M1.The resistance layer RS may include aluminum, copper, tungsten,molybdenum, and/or cobalt.

Connection structures CP may be provided in the third interlayerinsulating layer 130. The connection structures GP may be electricallyconnected to the resistance layer RS. Vias VI may be provided in thefourth interlayer insulating layer 140. The vias VI may include regularvias VIr and dummy vias VId. The regular vias VIr may be electricallyconnected to the resistance layer RS through the connection structuresCP, and the dummy vias VId might not be electrically connected to theresistance layer RS.

The dummy vias VId may overlap with the resistance layer RS when viewedin a plan view. The dummy vias VId may be spaced apart from theresistance layer RS with the third interlayer insulating layer 130interposed therebetween. The dummy vias VId may be spaced apart from theconnection structures CP with the third interlayer insulating layer 130interposed therebetween. A top surface of the third interlayerinsulating layer 130 may cover bottom surfaces of the dummy vias VId.

Interconnection lines M1 may be provided in the fifth interlayerinsulating layer 150. The interconnection lines M1 may be electricallyconnected to the regular vias VIr. The interconnection lines M1 mightnot be disposed on the dummy vias VId. A bottom surface of the fifthinterlayer insulating layer 150 may cover top surfaces of the dummy viasVId.

FIG. 19 is a layout of a capacitor provided from a cell library.

Referring to FIGS. 2 and 19, the cell library of the layout designprocess (S20) may include a layout CL of a capacitor. The layout CL ofthe capacitor may include interconnection line patterns M1 a. Each ofthe interconnection line patterns M1 a may include a first portion E1extending in a second direction D2 and a second portion E2 extending ina first direction D1.

FIG. 20 is a layout of a capacitor according to exemplary embodiments ofthe present inventive concepts, which is provided from a cell library.Here, the descriptions to the same technical features as in the layoutof the capacitor of FIG. 19 will be omitted and it may be understoodthat the omitted details are at least similar to the details ofcorresponding elements described elsewhere. Differences between thepresent embodiment and the layout of the capacitor of FIG. 19 will bemainly described hereinafter.

Referring to FIGS. 2 and 20, the layout design process (S20) may includeplacing additional layout patterns on the layout CL of the capacitor ofFIG. 19. For example, dummy connection patterns CPda and dummy viapatterns VIda may be additionally placed on the layout CL of thecapacitor of FIG. 19.

The dummy connection patterns CPda may overlap with the second portionsE2 of the interconnection line patterns M1 a. The dummy via patternsVIda may overlap with the dummy connection patterns CPda.

The dummy connection patterns CPda added may increase a pattern densityof connection patterns in the layout CL of the capacitor. The dummy viapatterns VIda added may increase a pattern density of via patterns inthe layout CL of the capacitor.

FIG. 21 is a plan view illustrating a semiconductor device according toexemplary embodiments of the inventive concepts. FIG. 22 is across-sectional view taken along a line A-A′ of FIG. 21. A semiconductordevice illustrated in FIGS. 21 and 22 is an example of a semiconductordevice that is realized on a physical substrate by using the layout ofthe capacitor of FIG. 20.

Referring to FIGS. 21 and 22, a capacitor CAP may be provided on asubstrate 100. For example, a second device isolation layer ST2 may beprovided on the substrate 100. First to fifth interlayer insulatinglayers 110, 120, 130, 140 and 150 may be sequentially stacked on thesecond device isolation layer ST2.

Dummy connection structures CPd may be provided in the third interlayerinsulating layer 130. The second interlayer insulating layer 120 maycompletely cover bottom surfaces of the dummy connection structures CPd.Dummy vias VId may be provided in the fourth interlayer insulating layer140. The dummy vias VId may be provided on the dummy connectionstructures CPd. Interconnection lines M1 may be provided in the fifthinterlayer insulating layer 150. Each of the interconnection lines M1may include a first portion E1 extending in a second direction D2 and asecond portion E2 extending in a first direction D1. The second portionE2 of each of the interconnection lines M1 may be provided on the dummyvias VId.

FIG. 23 is a layout of a capacitor according to exemplary embodiments ofthe present inventive concepts, which is provided from a cell library.Here, the descriptions to the same technical features as in theembodiment of FIG. 20 will be omitted and it may be understood that theomitted details are at least similar to the details of correspondingelements described elsewhere. Differences between the present embodimentand the embodiment of FIG. 20 will be mainly described hereinafter.

Referring to FIGS. 2 and 23, the layout design process (S20) may includeplacing additional layout patterns on the layout CL of the capacitor ofFIG. 19. For example, dummy via patterns VIda may be additionally placedon the layout CL of the capacitor of FIG. 19. As compared with thelayout CL of the capacitor of FIG. 20, the dummy connection patternsCPda may be omitted in the layout CL of the capacitor.

FIG. 24 is a plan view illustrating a semiconductor device according toexemplary embodiments of the present inventive concepts. FIG. 25 is across-sectional view taken along a line A-A′ of FIG. 24. A semiconductordevice illustrated in FIGS. 24 and 25 is an example of a semiconductordevice that is realized on a physical substrate by using the layout ofthe capacitor of FIG. 23. Here, the descriptions to the same technicalfeatures as in the embodiment of FIGS. 21 and 22 will be omitted and itmay be understood that the omitted details are at least similar to thedetails of corresponding elements described elsewhere. Differencesbetween the present embodiment and the embodiment of FIGS. 21 and 22will be mainly described hereinafter.

Referring to FIGS. 24 and 25, the dummy connection structures CPd may beomitted, unlike the capacitor CAP described above with reference toFIGS. 21 and 22.

In the semiconductor device according to exemplary embodiments of thepresent inventive concepts, the dummy vias may be additionally disposedto increase a pattern density of the vias. Thus, it is possible toreduce or minimize the distortion phenomenon of light which may becaused in the exposure process for forming the vias.

Exemplary embodiments described herein are illustrative, and manyvariations can be introduced without departing from the spirit of thedisclosure or from the scope of the appended claims. For example,elements and/or features of different exemplary embodiments may becombined with each other and/or substituted for each other within thescope of this disclosure and appended claims.

What is claimed is:
 1. A semiconductor device comprising: a substrateincluding a plurality of active patterns; a plurality of gate electrodesintersecting the plurality of active patterns; an active contactelectrically connected to the plurality of active patterns; a pluralityof vias comprising a first regular via and a first dummy via; and aplurality of interconnection lines disposed on the plurality of vias,wherein the plurality of interconnection lines comprise a firstinterconnection line disposed on both the first regular via and thefirst dummy via, wherein the first interconnection line is electricallyconnected to the active contact through the first regular via, whereineach of the plurality of vias includes a via body portion and a viabarrier portion covering a bottom surface and sidewalls of the via bodyportion, and wherein each of the plurality of interconnection linesincludes an interconnection line body portion and an interconnectionline barrier portion covering a bottom surface and sidewalls of theinterconnection line body portion.
 2. The semiconductor device of claim1, further comprising: an interlayer insulating layer covering theactive contact, wherein the plurality of vias are disposed on theinterlayer insulating layer, and wherein a top surface of the interlayerinsulating layer covers a bottom surface of the first dummy via.
 3. Thesemiconductor device of claim 1, further comprising: a connectionstructure disposed between the active contact and the first regular via,wherein the first dummy via is spaced apart from the connectionstructure.
 4. The semiconductor device of claim 1, further comprising: agate contact electrically connected to at least one of the plurality ofgate electrodes, wherein the plurality of vias further comprise: asecond regular via electrically connected to the gate contact; and asecond dummy via overlapping one of the plurality of gate electrodes,wherein the second dummy via is spaced apart from the one gate electrodewith an interlayer insulating layer interposed therebetween.
 5. Thesemiconductor device of claim 1, wherein the barrier portion of thefirst interconnection line is disposed between the via body portion ofthe first dummy via and the interconnection line body portion of thefirst interconnection line.
 6. The semiconductor device of claim 1,wherein the active contact includes an active contact body portion andan active contact barrier portion covering a bottom surface andsidewalls of the active contact body portion, and wherein the activecontact body portion of the active contact includes a conductivematerial different from that of the via body portion of each of theplurality of vias.
 7. The semiconductor device of claim 1, wherein thefirst interconnection line has an extension extending in a directionparallel with an extending direction of the gate electrodes, and whereinthe first dummy via is disposed under the extension.
 8. Thesemiconductor device of claim 1, wherein the first interconnection linehas an extension extending in a direction parallel with an extendingdirection of the gate electrodes, wherein the extension overlaps with aportion of the active contact, and wherein the first regular via isdisposed between the extension and the active contact.
 9. Thesemiconductor device of claim 1, wherein a width of the first dummy viain a first direction is greater than a width of the first regular via inthe first direction.
 10. The semiconductor device of claim 1, whereineach of the plurality of active patterns comprises: a first activepattern disposed on a PMOSFET region; and a second active patterndisposed on an NMOSFET region, wherein the first and second activepatterns each extend in a first direction, and wherein each of theplurality of gate electrodes extend in a second direction intersectingthe first direction.
 11. A semiconductor device comprising: a substrate;a plurality of transistors disposed on the substrate; a first interlayerinsulating layer covering the plurality of transistors; a secondinterlayer insulating layer disposed on the first interlayer insulatinglayer; a third interlayer insulating layer disposed on the secondinterlayer insulating layer; a dummy via disposed in the secondinterlayer insulating layer; and an interconnection line disposed on thethird interlayer insulating layer, wherein the first interlayerinsulating layer covers a bottom surface of the dummy via, wherein thedummy via includes a via body portion and a via barrier portion coveringa bottom surface and sidewalls of the via body portion, wherein theinterconnection line includes an interconnection line body portion andan interconnection line barrier portion covering a bottom surface andsidewalls of the interconnection line body portion, and wherein theinterconnection line barrier portion of the interconnection line isdisposed between the body portion of the dummy via and the body portionof the interconnection line.
 12. The semiconductor device of claim 11,further comprising: a contact disposed on the first interlayerinsulating layer, the contact electrically connected to the plurality oftransistors, wherein the dummy via is spaced apart from the contact. 13.The semiconductor device of claim 11, wherein the interconnection linebody portion of the interconnection line includes a same conductivematerial as the via body portion of the dummy via.
 14. The semiconductordevice of claim 11, further comprising: a regular via disposed on thesecond interlayer insulating layer, wherein the regular via electricallyconnects the interconnection line to the plurality of transistors. 15.The semiconductor device of claim 11, wherein the plurality oftransistors comprises: a plurality of first active patterns disposed ona PMOSFET region of the substrate; a plurality of second active patternsdisposed on an NMOSFET region of the substrate; and a plurality of gateelectrodes intersecting the plurality of first active patterns and theplurality of second active patterns.
 16. A semiconductor devicecomprising: a substrate; a first interlayer insulating layer disposed onthe substrate; a second interlayer insulating layer disposed on thefirst interlayer insulating layer; a third interlayer insulating layerdisposed on the second interlayer insulating layer; a connectionstructure disposed in the first interlayer insulating layer; a pluralityof vias disposed in the second interlayer insulating layer, theplurality of vias comprising a regular via and a dummy via; and aninterconnection line disposed in the third interlayer insulating layer,wherein the regular via is disposed between the interconnection line andthe connection structure and electrically connects the interconnectionline to the connection structure, wherein a level of a bottom surface ofthe dummy via is substantially the same as a level of a top surface ofthe connection structure, and wherein the dummy via is spaced apart fromthe connection structure, such that a top surface of the firstinterlayer insulating layer covers a bottom surface of the dummy via.17. The semiconductor device of claim 16, wherein the dummy via isdisposed under the interconnection line and is in contact with theinterconnection line.
 18. The semiconductor device of claim 16, furthercomprising: an active pattern disposed on the substrate; a gateelectrode disposed on the substrate; and a dummy connection structuredisposed in the first interlayer insulating layer and insulated fromboth the active pattern and the gate electrode, wherein the dummy via isdisposed on the dummy connection structure.
 19. The semiconductor deviceof claim 16, wherein the dummy via is spaced apart from theinterconnection line, and wherein a bottom surface of the thirdinterlayer insulating layer covers a top surface of the dummy via. 20.The semiconductor device of claim 16, wherein each of the plurality ofvias includes a via body portion and a via barrier portion covering abottom surface and sidewalls of the via body portion, and wherein theinterconnection line includes an interconnection line body portion andan interconnection line barrier portion covering a bottom surface andsidewalls of the interconnection line body portion.